Accendo Reliability https://fred-schenkelberg-project.prev01.rmkr.net Thu, 06 Jan 2022 23:37:15 +0000 en-US hourly 1 https://wordpress.org/?v=6.6.2 © 2025 FMS Reliability Illuminated Reliability Engineering Knowledge Accendo Reliability Illuminated Reliability Engineering Knowledge Accendo Reliability fms@fmsreliability.com No A Conversation with Greg Smith and Tony Lentz https://fred-schenkelberg-project.prev01.rmkr.net/podcast/the-reliability-fm-network/rm-032-conversation-greg-smith-tony-lentz-stencil-design-void-reduction/ https://fred-schenkelberg-project.prev01.rmkr.net/podcast/the-reliability-fm-network/rm-032-conversation-greg-smith-tony-lentz-stencil-design-void-reduction/#respond Tue, 14 Jan 2020 16:00:15 +0000 https://accendoreliability.com/?post_type=podcast&p=330061 A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction

Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction

Greg and Tony talk to me about stencil design and how to reduce voiding. Voiding is a key concern in specific electronic applications including automotive and LED electronic manufacturing. Greg and Tony published a paper entitled “Root Cause Stencil Design for SMT Component Thermal Lands”
Download here: https://tinyurl.com/szx3xt8

Greg Smith can be reached here: gsmith@blueringstencils.com

Tony Lentz can be reached here: tlentz@fctassembly.com

 

]]> https://fred-schenkelberg-project.prev01.rmkr.net/podcast/the-reliability-fm-network/rm-032-conversation-greg-smith-tony-lentz-stencil-design-void-reduction/feed/ 0 A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction Greg and Tony talk to me about stencil design and how to reduce voiding. Voiding is a key concern in specific electronic applications including automotive [...] No No 0:00 Mike Konrad