Today, we’re going to talk about cleanliness testing of post-reflowed circuit assemblies. In late 2018, IPC shocked the electronic assembly community by introducing an amendment to section 8 of the J-STD-001G. This amendment radically changed the way industry determines cleanliness. Now, assemblers must prove their assemblies are clean enough not to experience electro-chemical migration events which would cause the assembly to fail. 

This new process of obtaining objective evidence has been met with a considerable degree of confusion. To help clear up the confusion, I invited Graham Naisbitt to be my guest. Graham is an IEC 1906 Lord Kelvin Award Winner, IEC TC91 WG2, 3 and 10 Maintenance Leader of 4 Standards.
Graham is Vice-Chair of the IPC 5-30 Cleaning and Coating Sub-Committee which oversees 15 IPC Standards Development Committees and recipient of 14 IPC Standards Awards. Graham is also a British Standards Institution EPL-501 Member.

Graham is a specialist in Surface Insulation Resistance Testing, Ionic Contamination Control, Solderability, Conformal Coating materials and application systems, Cleaning, Inspection and Test.

Graham’s Webinar:
“Predicting Reliability in Electronics” with experts Graham Naisbitt
and Chris Hunt
https://iconnect007.com/index.php?cID=854

Graham’s Book:
“The Printed Circuit Assembler’s Guide to Process Validation”
https://iconnect007.com/my-i-connect007/books/process-validation/

Graham’s Contact Info:
graham.naisbitt@gen3systems.com