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An electronic device package with an areas that is generally equal to the area of the semiconductor device within.
« Back to Glossary IndexDie-scale package
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About Fred Schenkelberg
I am the reliability expert at FMS Reliability, a reliability engineering and management consulting firm I founded in 2004. I left Hewlett Packard (HP)’s Reliability Team, where I helped create a culture of reliability across the corporation, to assist other organizations.
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